Tensilica Reveals Plans for Design Automation Conference

Tensilica(R), Inc., provider of the broadest line of controller, CPU and specialty DSP processors on the market today, will participate in a number of workshops and panels at the 44th Annual Design Automation Conference (DAC) held June 4-8, 2007, in San Diego.

Sunday, June 3

1:30 p.m. – 3:00 p.m.
EDA Panel Discussion – Support for Universities, Microelectronic Systems Education Conference
Grant Martin, Tensilica Chief Scientist, panelist
San Diego Marriott

6:30 p.m. – 7:30 p.m.
“Challenges of HdS towards EDA” Workshop
Grant Martin, Tensilica Chief Scientist, panelist
Convention Center, Room 6F

Monday, June 4

12:00 p.m. – 5:00 p.m.
“Models for Design and Manufacturing – How Modeling Challenges are Touching Every Aspect of IC Design,” 3rd Integrated Design Systems Workshop
Chris Rowen, Tensilica CEO, presenter
Convention Center, Room 6A

12:00 p.m. – 2:00 p.m.
“Virtual Platform and ESL IP Exchange: Real World Challenges and What’s Expected from OSCI TLM 2.0,” OSCI Technical Symposium
Grant Martin, Tensilica Chief Scientist, panelist
Convention Center, Rooms 33ABC

Tuesday, June 5

10:30 a.m. – 12:00 p.m.
“Industrial Application of Systems Level Methods”
Grant Martin, Tensilica Chief Scientist, chair
Convention Center, Room 6D

11:30 a.m. – 1:00 p.m.
“Productivity Improvement and Risk Reduction in Low-Power Design”
Chris Rowen, Tensilica CEO, chair
San Diego Convention Center, Rooms 30CDE

Thursday, June 7

4:30 p.m. – 6:00 p.m.
“Dynamic Verification of Processors and Processor-Based Designs”
Grant Martin, Tensilica Chief Scientist, chair
Convention Center, Room 6B

The 44th Annual DAC will be held at the San Diego Convention Center.

Tensilica, Inc., is the recognized leader in configurable processor technology and has leveraged that technology to become the leading supplier of licensable controllers and DSP cores for mobile audio and video applications. Tensilica offers the broadest line of controller, CPU, network, and specialty DSP processors on the market today – including full software toolchain and modeling support – in both an off-the-shelf format via the Diamond Standard Series cores and with full designer configurability with the Xtensa processor family. The modern design behind all of Tensilica’s processor cores provide semiconductor companies and system OEMs with the lowest power, smallest area solutions for high-volume products including mobile phones and other consumer electronics, networking and telecommunications equipment, and computer peripherals.

Tensilica and Xtensa are registered trademarks belonging to Tensilica Inc.