Optimal Corporation(TM) will demonstrate its 3D power and signal integrity analysis tools for integrated circuit (IC) package, System-in-Package (SiP) and printed circuit board (PCB) design in Booth #3063 during the 44th Design Automation Conference (DAC). DAC will be held June 4-8 at the San Diego Convention Center in San Diego, Calif.
In addition, demonstrations will highlight newly expanded capabilities of Optimal’s flagship PakSi-E, quasi-static electro-magnetic analysis software. PakSi-E’s performance has been improved by approximately 3X across a range of designs with no sacrifice in accuracy. Other improvements include a newly integrated CAD front-end, an overhauled and modernized graphical user interface (GUI), and Linux and 64-bit support.
More info: Design Automation Conference
About Optimal Corporation
Optimal Corporation is a leader in 3D power, signal and thermal integrity analysis for IC Package, System-in-Package (SiP) and PCB design. Its innovative solutions enable design teams to concurrently analyze and optimize the IC with the package and the packaged IC on the PCB. By providing high-performance, ease-of-use and pinpoint accuracy, Optimal’s solutions allow engineers to quickly create designs optimized for power and signal integrity. Through seamless integration with all of the major CAD design flows, its solutions help customers achieve fast and efficient design time. Optimal’s technology is embedded within the Cadence Allegro design flow and endorsed in the TSMC Reference Flow. Optimal, founded in 1995, is a TSMC Technology Alliance Partner and a member of the Cadence Connections Emerging Solutions Program. Optimal Corporation is located at: 6980 Santa Teresa Blvd., Suite 100, San Jose, Calif. 95119-1346. Telephone: 408-363-6300. Facsimile: 408-363-6305. Email: email@example.com.
Optimal Corporation and the Optimal logo are trademarks of Optimal Corporation.