eASIC Corporation, a provider of Structured ASIC devices, announced that it has entered into partnership agreement with Premier Technical Sales, a leading high-tech manufacturers’ representative of major global electronic suppliers. With this partnership, eASIC further expands its global sales channel organization to provide extensive commercial and technical support in North America for its Nextreme Structured ASIC products. Leveraging its semiconductor market experience, Premier will support the rapid customer demand of Nextreme Structured ASICs.
“Premier is eager to deliver the Nextreme Structured ASIC solution to FPGA, ASIC and embedded system designers who are looking for an optimal alternative to replace existing costly custom design solutions,” said Steve Dowdell, President of Premier Technical Sales. “eASIC’s Nextreme devices are extremely attractive for many applications as they are affordable and can be delivered in 3-4 weeks with no mask charges and no minimum order quantity. Moreover, eASIC’s growing IP portfolio allows designers to build configurable systems that feature low-cost product differentiation combined with standard reusable functions.”
“We are pleased to partner with Premier Technology and expand our regional service and support for the Nextreme products in North America,” said Fred Lancia, eASIC’s Vice President of Sales. “eASIC will work closely with Premier to establish a significant presence for our breakthrough Structured ASIC products, joining forces to provide world class sales support and superior customer service. This addition to our global sales and distribution organization helps in building market share and augmenting revenue.”
About Premier Technical Sales
Premier Technical Sales, Inc. provides professional, technical sales representation for leading semiconductor and subsystem manufacturers in Silicon Valley and other major computer/electronics markets in North America, Europe and Asia.
eASIC is a fabless semiconductor company offering breakthrough Structured ASIC devices aimed at dramatically reducing the overall fabrication cost and time of customized semiconductor chips. Low-cost, high-performance and fast-turn ASIC and System-on-Chip designs are enabled through patented technology of FPGA-like programmable logic coupled with ASIC-like Via-layer customizable routing. This innovative fabric efficiently employs mask-less customization with Direct-write e-Beam, and thus allows eASIC to offer Structured ASICs with no mask-charges. Founded in 1999, eASIC Corporation is privately held, headquartered in Santa Clara, California. Investors include Vinod Khosla, Kleiner Perkins Caufield and Byers (KPCB), Crescendo Ventures, and Evergreen Partners.