Honeywell (NYSE: HON) announced that it has developed a new line of sophisticated electronic components designed specifically to meet the stringent reliability requirements for computers operating in technically advanced military and commercial aerospace conditions. Honeywell’s microelectronics product offering includes next-generation integrated circuits manufactured to withstand the shock, vibration and extreme radiation conditions that occur in space and other military environments. The components are developed using the company’s radiation-hardened, silicon-on-insulator (SOI) complementary metal oxide semiconductor (CMOS) technology.
“We’re offering design engineers a large selection of innovative products for use in new and existing systems,” said David Wick, Director, Microelectronics Sales, Honeywell Defense and Space. “These highly advanced, small circuits offer significantly reduced power consumption and improved reliability in the harshest of environments.”
The new microelectronic produce line includes the following components:
A 12-million gate Application Specific Integrated Circuit (ASIC) specifically designed for radiation-tolerant and radiation-hardened applications. The HX5000 can be configured by customers using the Synopsys Design Automation Galaxy ASIC design software to integrate digital logic, microcontrollers, multi-channel multi-gigabit per second communication port and static memory functions onto a single integrated circuit.
A 16-million bit Static Read Access Memory (SRAM) that provides a memory function four times the memory density than earlier SRAM components. The HXSRO1608 features 60% lower power and requires 75% less circuit board space than previous available 5V SRAM products. The new SRAM can be used for new system designs or to replace older SRAM functions.
The first non volatile Magnetic RAM (MRAM) to combine SOI CMOS technology with magnetic thin films. The HXNVO100 is a one-million bit MRAM for strategic space electronics applications and can be used as a replacement for plated wire memory, as the program memory function.
- RHPPC Processor
A single-package, radiation-hardened component for space borne electronic systems based on Freescale’s 603e(TM) processor. Applications include single board computers that manage data processing, and controls on satellites and launch vehicles.
All of the new components are produced at Honeywell’s Trusted Foundry in Plymouth, Minnesota. Honeywell is one of just two radiation-hardened wafer foundries in the United States to earn the Department of Defense’s Accreditation of Trust. The accreditation applies to the company’s 0.15-micron, 0.35-micron and 0.8-micron silicon wafer processes.
Silicon wafers are used to make Application Specific Integrated Circuits (ASIC) and memory components, which are subsequently used in commercial and military avionics systems, payload electronics for commercial and military space systems, inertial measurement units, flight control systems, circuit replacement programs and many other aerospace systems.
Honeywell International is a $33 billion diversified technology and manufacturing leader, serving customers worldwide with aerospace products and services; control technologies for buildings, homes and industry; automotive products; turbochargers; and specialty materials. Based in Morris Township, N.J., Honeywell’s shares are traded on the New York, London and Chicago Stock Exchanges. It is one of the 30 stocks that make up the Dow Jones Industrial Average and is also a component of the Standard & Poor’s 500 Index.
Based in Phoenix, Honeywell’s aerospace business is a leading global provider of integrated avionics, engines, systems and service solutions for aircraft manufacturers, airlines, business and general aviation, military, space and airport operations.