Synapse Rolls Out SNAP ZigBee RF Module with 3 Mile Range
Synapse(R) introduced its RF Engine, a wireless module with a range of up to three miles that is used to power Synapse SNAP(TM) (Synapse Network Appliance Protocol(TM)) and ZigBee(R) wireless networks. The Synapse RF Engine(TM) is a small, low-power, plug-in RF transmitter-receiver module that can be used in conjunction with users’ own devices or with Synapse’s product line. The Synapse RF Engine is available in a variety of configurations: with or without amplification, with an internal (F) antenna or an external SMA antenna, and running SNAP or a full ZigBee stack.
CableLabs Certifies SMC EZ Connect Telephony Modem
SMC(R) Networks announced that CableLabs(R) has certified its newest product for the Cable Service Provider market, the EZ Connect(TM) E-MTA (SMC8414WG), for compliance with the PacketCable(TM) 1.5 and DOCSIS(R) 2.0 specifications in its Certification Wave 50.
Synapse Controls SNAP ZigBee Wireless Networks
Synapse announced its Portal PC-based software for configuring and controlling of SNAP(TM) (Synapse Network Appliance Protocol(TM)) and ZigBee(R) wireless networks. Synapse Portal(R) network administration software allows the user to configure and change complex behavior of End Devices without complex programming using simple scripts to define behavior. Versions of Synapse Portal can also support up to 65,000 devices, provide an accessible API (Application Programming Interface) for interfacing with third-party applications, and have Internet accessibility so users can configure, control, and monitor their network and devices from anywhere.
General Dynamics Extends LTA with GE Fanuc Embedded Systems
GE Fanuc Embedded Systems announced that its recent acquisition Radstone Embedded Computing had received authorization to disclose an extension to a Long Term Agreement (LTA) from General Dynamics Land Systems (GDLS), a subsidiary of General Dynamics Corporation, in respect of continuing supply of Radstone processor and graphics boards for the US Army’s M1A2 Abrams tank Continuous Electronics Enhancement Program (CEEP) (now known as M1A2 SEP V2). The new LTA is valued at $41 million, and extends an earlier LTA valued at over $22 million.
Lattice LEADER Gains Electronic Product Development Expertise
Lattice Semiconductor Corporation (NASDAQ: LSCC) announced that IRCONA, an Irish design services company specializing in leading edge electronic product development, has joined the Lattice LEADER Design Services Program, a highly select global network of companies. IRCONA will apply its expertise in very high-speed digital and embedded software design to expand the range of products in which Lattice devices are integrated. IRCONA has a long history of developing products based upon Lattice’s latest devices, and expects this relationship to expand with its membership in the LEADER program.
AXIOMTEK Announces Intel Core 2 Duo COM Express Module
AXIOMTEK, as a trusted Applied Computing Platform provider, is proud to announce a new high performance Intel(R) Core(TM)2 Duo COM Express module, the CEM830, to appeal to a wide range of vertical embedded markets. Packed as a super component, it is designed to be future proof and to provide a smooth transition path from parallel PCI bus to serial PCI Express buses. Rich complements of contemporary high bandwidth serial interfaces include PCI Express, Serial ATA, USB 2.0, and Gigabit Ethernet.
Samsung Mass Produces 51nm 16Gb NAND Flash Memory
Samsung Electronics Co., Ltd., a leader in advanced semiconductor technology, announced that it has become the first to begin mass producing 16 gigabit (Gb) NAND flash, the highest capacity memory chip now available. The company said it will fabricate the devices in 51 nanometers (nm), the finest process technology to be used in memory mass production to date.
Agilent Rolls Out Low-Cost In-Circuit Test System for ODM
Agilent Technologies Inc. (NYSE:A) introduced a low-cost in-circuit test system for original design manufacturers who need “just enough test.” The new system provides a cost-effective means to achieve the highest confidence in testing high-volume digital consumer and personal computer motherboards.
Leading Publications Honor Microchip Technology
Microchip Technology Inc., a leading provider of microcontroller and analog semiconductors, announced that it has been recognized by several electronics magazines and a prominent Arizona business publication for product and organizational leadership, along with recognition for strong employee contributions from a major charity.
Agilent Doubles Throughput with 3D X-Ray Inspection System
Agilent Technologies Inc. (NYSE:A) announced a breakthrough for in-line 3D X-ray inspection systems that detect printed circuit board assembly (PCBA) solder and manufacturing assembly defects. The Agilent Medalist x6000 AXI reduces customers’ manufacturing conversion costs without compromising defect-detection capability. It accomplishes this by more than doubling the throughput of market-leading 3D solutions while using full 3D capability to find defects.
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