Silicon Integration Initiative Releases ECSM 2.2 Specs

The Silicon Integration Initiative (Si2) released the Effective Current Source Modeling (ECSM) Version 2.2 specification, which includes extensions for modeling Signal Integrity. Building on the ECSM Timing and Power extensions previously released by the Si2 Open Modeling Coalition (OMC), the Signal Integrity (SI) extensions bring Noise modeling to the ECSM open modeling standard which now provides a complete and highly accurate modeling solution for sign-off analysis. With Timing, Noise, & Power modeling in the one standard format, IP providers will benefit from greater simplicity and efficiency in the library creation process as well as a simplified distribution model. Users will also benefit from the simplified flow setup and library management while supporting all of their sign-off modeling needs.

The risk of signal integrity-related failures in silicon increases greatly at the 90nm process node and below. Using advanced voltage-in/voltage-out relationships, the SI Extensions enable SI analysis tools to model the cumulative effects of noise introduced by coupling capacitances in complex scenarios where multi-Vt & multi-voltage devices commingle. This format is based on the cdB noise model in CeltIC which has been proven in over 1,000 tapeouts. When used in conjunction with Power and Timing extensions, the SI extensions to ECSM will accurately measure the cumulative impact of IR Drop and Noise on delay to provide a more holistic view of timing as well as power sign-off.

“Since its formation in 2005, the OMC has been progressing rapidly towards a comprehensive library modeling system and standard that will change the way design libraries are produced and consumed,” said Tim Ehrler, OMC chair and senior manager of CAD Global Infrastructure at AMD. “The OMC continues to produce deliverables on schedule with this announcement of the next version of the ECSM standard. This collaborative effort by EDA, IP, and IDM industry leaders will ease the way as the semiconductor industry moves toward smaller process nodes.”

With the completion of the 2.2 specifications, the OMC will next focus on extending ECSM into the area of Statistical Analysis.

The new ECSM 2.2 Specification is available for download.

About the Open Modeling Coalition (OMC)
The OMC technical objectives are to define a consistent modeling and characterization environment in support of both static and dynamic library representations for improved integration and adoption of advanced library features and capabilities, such as statistical timing. The system will support delay modeling for library cells, macro-blocks and IP blocks, and provide increased accuracy to silicon for 90nm and 65nm technologies, while being extensible to future technology nodes. Member companies are: Advanced Micro Devices (NYSE:AMD), Altos Design Automation, ARM (Nasdaq:ARMHY), Cadence Design Systems (Nasdaq:CDNS), Extreme DA, Freescale, IBM (NYSE:IBM), Intel (Nasdaq:INTC), LSI Logic (NYSE:LSI), NXP Semiconductors, Renesas Technology Corp., Silicon Navigator, ST Microelectronics (NYSE:STM), Sun Microsystems (Nasdaq:SUNW), and Virage Logic (Nasdaq:VIRL).

About Si2
Si2 is an organization of industry-leading semiconductor, systems, EDA and manufacturing companies focused on improving the way integrated circuits are designed and manufactured in order to speed time-to-market, reduce costs, and meet the challenges of sub-micron design. Si2 is uniquely positioned to enable collaboration through a strong implementation focus driven by its member companies. Si2 focuses on developing practical technology solutions to industry challenges. Si2 represents over 100 companies involved in all parts of the silicon supply chain throughout the world.