Tower Semiconductor to Manufacture Image Sensors for Jet Propulsion Lab

Tower Semiconductor Ltd. (NASDAQ:TSEM) (TASE:TSEM), an independent specialty foundry, announced that it was chosen by the Jet Propulsion Laboratory (JPL) to manufacture a CMOS image sensor for use in the development of its advanced MultiSpectral Polarimetric Imager (MSPI). The device utilizes an image sensor process at Tower’s Fab1 facility.

This design is JPL’s fifth submission to Tower, dating back to April, 2001. The previous submissions totaled 28 different designs, with this latest design being the most challenging of the series fabricated for JPL by Tower.

Through its airborne and planned space-borne implementation, the MSPI is intended for the study of atmospheric aerosols. Utilizing complex Analog-to-Digital (ADC) design techniques, the high-speed on-chip 50-Megasamples per second ADC is 9-bit square-root-encoded, resulting in the equivalent of 14-bit quantization at low signal levels. With high Quantum Efficiency and 10-electron read noise, the imager is ideal for JPL’s latest state-of-the-art scientific application which requires flexibility in addressing rows in the imager.

“We are pleased to partner with the highly professional team at JPL, supporting this product’s demanding specs,” said Dr. Avi Strum, general manager of CIS and NVM product lines at Tower. “I trust that our long standing relationships will further evolve while we team up to challenge new frontiers in the areas at which JPL excels.”

About Tower Semiconductor Ltd.
Tower Semiconductor Ltd. is an independent specialty foundry established in 1993. The company manufactures integrated circuits with geometries ranging from 1.0 to 0.13-micron; it also provides complementary technical services and design support. In addition to digital CMOS process technology, Tower offers advanced non-volatile memory solutions, mixed-signal & RF-CMOS, and CMOS image-sensor technologies. To provide world-class customer service, the company maintains two manufacturing facilities: Fab 1 has process standard and specialized technologies from 1.0 to 0.35 micron and Fab 2 features standard and specialized technologies of 0.18, 0.16 and 0.13-micron.

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