Ambric to Present Paper, Serve on Panel at Multicore Expo

Posted by EDA Geek News Staff in Events, Training on Wednesday, March 28, 2007
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Steve Frison, vice president of software engineering and Mike Butts, a Fellow and lead chip architect at fabless semiconductor company, Ambric Inc. Mr. Frison will present a paper entitled, "Solving the Programming Bottleneck for Massively-Parallel MIMD Applications." Mr. Butts will serve on a panel discussing the topic "Will Interconnect Be A Bottleneck for Multicore Platforms?"

Wednesday, March 28, 2007

  • 2:20 p.m. to 2:50 p.m. PDT: Mr. Frison will present his paper
  • 5:00 p.m. to 5:50 p.m. PDT: Mr. Butts will participate on the panel moderated by John Blyler, editorial director, Chip Design Magazine

Multicore Expo 2007
Santa Clara Convention Center
5001 Great America Parkway
Santa Clara, Calif.

About Ambric, Inc.
Ambric is a fabless semiconductor company that has developed the world's first chip that makes massively-parallel software programming practical for complex embedded electronics systems. The company's scalable, teraOPS-class chips deliver performance that is more than an order of magnitude higher than high-end DSPs and rivals the performance of FPGAs on many applications. Ambric products will help electronics companies accelerate time-to-market for their products while slashing their system development costs. Established in 2003 and headquartered in Beaverton, Ore., Ambric has received funding from ComVentures, OVP Venture Partners, Northwest Technology Ventures, and private investors.

Ambric, the Ambric logo, and Am2XXX are trademarks of Ambric, Inc.

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