QUALCOMM QSC Chips Enable Lower Prices for Handsets

QUALCOMM Incorporated (Nasdaq: QCOM), a leading developer and innovator of Code Division Multiple Access (CDMA) and other advanced wireless technologies, announced the success of entry-level handset launches around the world based on QUALCOMM technology. QUALCOMM’s Single Chip(TM) (QSC(TM)) products are enabling handsets that lower price barriers and deliver cost-competitive wireless connectivity to markets such as China and India. The continuing expansion of the QSC family will enable lower-cost, full-featured devices to wireless users around the world.

“Huawei believes that developing markets are a very important area of growth for the wireless industry, and we continue to innovate for this segment,” said Mr. Guo Ping, president of Huawei Mobile. “QUALCOMM’s QSC family plays an important role in our efforts to make wireless affordable to a wider base of users.”

“QUALCOMM’s innovative wireless technologies have been a key enabler for operators to deliver new, compelling applications and superior services to consumers at affordable prices,” said Darryl Green, chief executive officer of Tata Teleservices, Ltd. “Tata Teleservices is committed to supporting QUALCOMM in their efforts to deliver market-leading products for the wireless world based on its innovative Single Chip family of products. The specific initiatives in integrating imaging, graphics, audio and video in a single-chip solution will further empower us to offer high-quality multimedia handsets at affordable costs.”

“ZTE invests significant resources and efforts into designing lower-cost, yet very attractive devices for cost-sensitive markets,” said Mr. He Shiyou, senior vice president of ZTE. “The high level of integration and numerous benefits that QUALCOMM offers with its QSC products have already led to great success, and it allows us to maintain our leading position in offering very cost-efficient and feature-rich handsets to drive the overall growth of the wireless market.”

“QUALCOMM’s QSC family utilizes integration to bring mobile communications to new subscribers around the world, and we are very pleased by our success thus far in lowering price points and driving down costs,” said Dr. Sanjay K. Jha, chief operating officer of QUALCOMM and president of QUALCOMM CDMA Technologies. “Our continued innovation and investments will lead to even more cost-efficient devices that offer more benefits of CDMA2000(R) connectivity to mass markets.”

Handsets based on QUALCOMM’s QSC6010(TM) single-chip solution have already launched in emerging markets around the world with more launches anticipated throughout the year. The Company’s QSC1100(TM) solution, a third-generation QSC product scheduled to sample later this year, is expected to enable even lower-cost CDMA2000 handsets while delivering benefits such as doubled talk time.

Products in the QSC family integrate baseband modem, RF transceiver, power management and system memory into a single chip to reduce the number of discrete components, lower bill-of-materials costs and deliver board-area savings of up to 50 percent. Manufacturers can now offer smaller and sleeker designs at significantly lower price points and benefit from reduced development time for quicker time to market. The latest additions to the QSC family feature support for mobile broadband.

QUALCOMM Incorporated is a leader in developing and delivering innovative digital wireless communications products and services based on CDMA and other advanced technologies. Headquartered in San Diego, Calif., QUALCOMM is included in the S&P 500 Index and is a 2006 FORTUNE 500(R) company traded on The Nasdaq Stock Market(R) under the ticker symbol QCOM.

QUALCOMM is a registered trademark of QUALCOMM Incorporated. QUALCOMM Single-Chip, QSC, QSC 6010 and QSC 1100 are trademarks of QUALCOMM Incorporated. CDMA2000 is a registered trademark of the Telecommunications Industry Association (TIA USA).