Tower Semiconductor Ramps up Zoran ICs on .16 Micron Process
Tower Semiconductor, Ltd., a pure-play independent specialty wafer foundry (NASDAQ:TSEM)(TASE:TSEM) announced that it has begun manufacturing additional Zoran Corporation ICs at Tower’s FAB2, using its cost-effective 0.16-micron geometry.
“We appreciate Tower’s close collaboration, high level of customer support and the cost-effective technology Tower developed at Fab-2,” said Tzach Hadas, vice president operations at Zoran. “This launch is a result of our long standing relationship with Tower, and we have high expectations for continued future cooperation while we further push the design and technology envelopes beyond their existing limitations.”
“We are pleased to complement Zoran’s expertise in digital solutions with our advanced 0.16-micron geometry offering that provides a cost-effective solution for intricate digital functionality such as that implemented in Zoran’s advanced products,” said Dani Ashkenazi, General Manager of Core-CMOS product line at Tower. “We take pride in supporting technology-savvy customers, such as Zoran, with very fast ramps to volume production.”
About Tower Semiconductor Ltd.
Tower Semiconductor Ltd. is a pure-play independent specialty wafer foundry established in 1993. The company manufactures integrated circuits with geometries ranging from 1.0 to 0.13-micron; it also provides complementary technical services and design support. In addition to digital CMOS process technology, Tower offers advanced non-volatile memory solutions, mixed-signal & RF-CMOS, and CMOS image-sensor technologies. To provide world-class customer service, the company maintains two manufacturing facilities, each with standard and specialized process technology processes: Fab 1 ranging from 1.0 to 0.35 and Fab 2 featuring 0.18 and 0.13-micron.
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