Archive for February 2007

IP Infusion Selects Enea for High-Availability Network Protocols

Posted by EDA Geek News Staff in Networking on Wednesday, February 28, 2007

Enea (Stockholm: ENEA.ST), the leader in advanced device software for network equipment, and IP Infusion announced a strategic alliance through which IP Infusion will use Enea's Accelerator Platform(TM) to add high availability to their Layer 2 and Layer 3 routing and switching protocols. Enea and IP Infusion, together with Kontron and Tail-f, will demonstrate the new high-availability software at the Mountain View Alliance Communications and Ecosystems Conference, which will be hosted in San Diego from February 28 – March 2.

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Kontron Rolls Out EPIC/PM Board

Posted by EDA Geek News Staff in Boards, Busses on Wednesday, February 28, 2007

Kontron introduces with the EPIC/PM the second in its series of EPIC standard boards recognized by the PC/104 Consortium. The Kontron EPIC/PM is based on the 90nm Intel(R) Pentium(R) M 745 processor and offers complete PC/104-Plus functionality with both PCI and ISA expansion. As with other Kontron products, the EPIC family of boards maintains the same internal and external I/O connector locations for easy scalability without changing the enclosure design.

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Converged Mobile Devices Grow by 42%

Posted by EDA Geek News Staff in Research, Wireless on Tuesday, February 27, 2007

The worldwide market for converged mobile devices pushed past the 20 million unit mark during the fourth quarter of 2006, and past the 80 million unit mark for the year. According to IDC's Worldwide Mobile Phone Tracker, vendors shipped a total of 23.5 million devices during the fourth quarter of 2006, 33.5% more than the same quarter a year ago. For 2006, vendors shipped 80.5 million devices, 42.0% more than what they shipped in 2005.

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Ansoft, SAMSUNG Unveil Multilayer Ceramic Chip Capacitor Models

Posted by EDA Geek News Staff in Models, Simulations on Tuesday, February 27, 2007

Ansoft Corporation (NASDAQ:ANST) and SAMSUNG (Samsung Electro-Mechanics Co. Ltd.) announced the release of a new model library of SAMSUNG's high-density, miniaturized surface-mount Multilayer Ceramic Chip Capacitors (MLCC). MLCCs are used for decoupling and temperature compensation in applications where PC board space is limited. They are ideal for new wireless and portable product designs, including notebook computers, mobile phones, PDAs, camcorders, VCRs, telecommunications and test equipment. The new MLCC library allows engineers using Nexxim(R) and Ansoft Designer(R) to simulate advanced PCB and hybrid IC designs.

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TI Announces 24-bit, 96-kHz Digital Audio Interface Receiver

Posted by EDA Geek News Staff in Components on Tuesday, February 27, 2007

Texas Instruments Incorporated (TI) (NYSE: TXN) introduced a 24-bit, 96-kHz digital audio interface receiver that provides the industry's best jitter performance as low as 50 ps RMS, which is four times better than the nearest stand-alone receiver. This highly-integrated device reduces the number of external components required and enhances sound quality in applications such as AV/DVD receivers and amplifiers, automotive audio systems, digital televisions, musical instruments, recording systems and high-performance PC audio interfaces.

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Aero Simulation Upgrades Navy with Quantum3D Models

Posted by EDA Geek News Staff in Models, Simulations on Tuesday, February 27, 2007

Quantum3D, Inc., a leading provider of Commercial Off-the-Shelf (COTS), open architecture, realtime 3-Dimensional (3D) visual computing solutions, announced that Aero Simulation, Inc. (ASI), selected Quantum3D IDX 3000 and Facets Models and related database environments as part of the Navy's upgrade to the Landing Signal Officer Trainer (LSOT).

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