Kontron announces MicroTCA Validation Systems in close cooperation with Schroff. As a spin-off technology of the latest PICMG industry standard AdvancedTCA, MicroTCA is gathering significant attention for smaller scale communications solutions as well as in non-communications applications such as industrial and medical. MicroTCA is using standard Advanced Mezzanine Cards (AdvancedMCs) from the AdvancedTCA world in a ‘direct-to-backplane’ configuration. The first release of the PICMG standard for MicroTCA was achieved in July 2006. In 2007, it is expected that this technology moves from design to actual products.
In order to ease the evaluation of this new technology, Kontron and Schroff have aligned to offer proven, ready-to-run validation systems. These systems are available for two kinds of applications: redundant designs with carrier grade availability in telecom applications, or non-telecom applications without redundancy, but high demand of processing performance with low latency.
Kontron brings its leading position in AdvancedMCs into this partnership including leading edge single- and dual-core based processor AdvancedMCs, Gigabit Ethernet AdvancedMCs or Storage AdvancedMCs. The systems include a validated leading-edge MicroTCA Controller Hub (MCH).
In order to explore the full benefits of MicroTCA, relevant systems need to be able to adapt to a wide range of housing and backplane topologies. This is the domain of Schroff, a pioneer and world-leader of AdvancedTCA and MicroTCA technologies. With Schroff’s leading position in chassis, fans, power and backplanes, Schroff is the first choice for MicroTCA.
Kontron and Schroff are looking back on a record of cooperation and joint validation of MicroTCA. “Now is the time to move ahead”, says Tom Meyer, Director Kontron Communication. “We are providing a stable environment to validate and qualify this new technology. Together with our proven partners, we are offering a solid base for MicroTCA validation.”
“Schroff has already developed a full range of µTCA chassis solutions with mechanics, backplanes and managed cooling units. Therefore we are looking forward to validating our components together with the Kontron AdvancedMC modules. We are sure, together to create a complete platform for a large variety of MicroTCA applications,” says Volker Haag, Director of Engineering at Schroff.
Schroff with its headquarters in Straubenhardt/Germany is a leading developer and manufacturer of electronic packaging systems for technologies such as electronics, automation, IT and communication worldwide. The standard product range extends from cabinets, cases and sub racks to power supplies, backplanes and micro computer systems such as VME, CompactPCI, AdvancedTCA and MicroTCA. Utilising its product platforms Schroff is able to offer customized modifications in a fast and cost effective way. Its extensive integration service combines both products and services providing complete packaging solutions with a true customer benefit.
Kontron designs and manufactures standard-based and custom embedded and mobile rugged solutions for OEMs, systems integrators, and application providers in a variety of markets. Kontron engineering and manufacturing facilities, located throughout Europe, North America, and Asia-Pacific, work together with streamlined global sales and support services to help customers reduce their time-to-market and gain a competitive advantage. Kontron’s diverse product portfolio includes: Computer-on-Modules, SBCs/blades, open-modular platforms and systems, HMIs, mobile rugged workstations, and custom capabilities. Kontron is a Premier member of the Intel(R) Communications Alliance and was awarded 2006 Intel Member of the Year. The company is a recent three-time VDC Platinum vendor for Embedded Computer Boards. Kontron is listed on the German TecDAX 30 stock exchange under the symbol “KBC”.