Motorola, TI Team on High-Volume 3G, WiMAX, OMAP for Mobile Devices

Motorola, Inc. (NYSE:MOT), a global leader in mobile communications and seamless mobility solutions, and Texas Instruments Incorporated (TI) (NYSE:TI), a global leader in silicon solutions for wireless communications, announced that the companies are expanding their strategic relationship to include 3G, WiMAX and OMAP(TM) technologies in the design and development of new, experience-optimized mobile devices. The expanded relationship covers current, emerging and next-generation wireless standards and leverages intellectual property from both Motorola and TI.

As part of the expansion, Motorola is developing 3G handsets based on a TI customized 3G solution that will include high-performance, power-efficient processors from TI’s OMAP 3 architecture, as well as advanced, unique 3G and 3.5G building blocks from both Motorola and TI. New handsets using this solution are expected to be available to consumers as early as 2008.

Additionally, TI is supporting Motorola’s mobile WiMAX initiative, including development of a customized Motorola WiMAX solution, and providing digital design elements, high-performance analog components, RF solutions, and manufacturing process and fabrication expertise. The solution will focus on core 802.16e mobile WiMAX functionality supporting voice, video and data for low-power mobile applications. The solution will be manufactured in 65nm and is expected to be ready to support production of new mobile devices that Motorola plans to launch during 2008.

“Motorola is working aggressively to design and deliver the world’s most comprehensive portfolio of mobile devices that unite market-leading ‘must have’ design with fully optimized and unmatched ‘must do’ experiences,” said Ron Garriques, executive vice president of Motorola and president of Motorola’s Mobile Devices business. “TI is a highly valued supplier, and I am excited about the opportunities that we are pursuing together. Both of our companies are proven pioneers of innovation. Through our close collaboration on chipset technology, Motorola has developed mobile devices that are not only feature rich and affordable but also aspirational. Today’s announcement significantly expands what Motorola will be bringing to market in the future.”

To meet the growing need for affordable multimedia-rich capabilities in handsets, Motorola has also selected solutions from TI’s OMAP 2 and OMAP 3 product portfolio and OMAP-VoxTM family, including the OMAPV1035 GSM/GPRS/EDGE single-chip solution from the “eCosto” platform and the OMAPV1030 GSM/GPRS/EDGE chipset. Motorola plans to use the OMAPV1035 solution, which leverages TI’s innovative DRPTM technology, in new low-cost multimedia mobile devices expected to be in the market in 2008. Motorola also plans to use the OMAPV1030 chipset in new mid-range multimedia mobile devices expected to be in the market later this year.

“Motorola is a market leader committed to delivering innovative handsets that address the growing wireless landscape,” said Rich Templeton, president and CEO of TI. “TI is delighted to expand its strong relationship with Motorola as we work closely with them to deliver the products and solutions they need. From 2.5G to 3G to the next generation of wireless standards such as WiMAX, Motorola’s diverse market requirements fit well with the depth and strength of TI’s proven product portfolio.”