Concurrent Debuts AMC Processor Module with Dual-Core Intel Xeon

Concurrent Technologies announce their latest, very high performance Advanced Mezzanine Card (AdvancedMC(R)) double width full height processor module suitable for AdvancedTCA(R), MicroTCA(TM) and proprietary platforms. The AM 100/20x uses the Dual-Core Intel(R) Xeon(R) processor to provide high performance processing, and the Intel(R) 3100 chipset, which combines server-class memory and I/O controller functions into a single component.

Concurrent Technologies AMC Processor Module features Dual-Core Intel Xeon Processor

The AM 100/20x is designed for use in a variety of applications including wireless base stations, Voice over IP, media-servers, blade-servers within the communication market as well as projects within the defence, security, and industrial markets. Accordingly, the AM 100/20x supports a variety of industry standard operating systems.

Glen Fawcett, CEO of Concurrent Technologies commented: “This new high performance AMC processor board provides a marked improvement in performance/watt compared to a single-core Intel(R) Xeon(R) processor. By using processors and chipsets from Intel’s embedded roadmap, we can ensure that the product will be available for at least 5 years after release – a very important requirement for the majority of our customer base, whether they are in the defence or telco market sectors.”

The AM 100/20x module supports the Dual-Core Intel Xeon Processor LV @ 2.0 GHz or the Dual-Core Intel Xeon Processor ULV @ 1.66 GHz. By using appropriate operating systems and applications software, a computing performance increase, for the same clock frequency, of up to two times a single-core Intel Xeon processor is achievable. The Thermal Design Power (TDP) for the Dual-Core Intel Xeon Processor LV @ 2.0 GHz (667MHz FSB, 2MB shared L2 cache) is 31W versus 35W TDP for the single-core LV Intel Xeon processor @ 2.0 GHz (400MHz FSB, 512KB L2 cache); the Dual-Core Intel Xeon Processor ULV @ 1.66 GHz (667MHz FSB, 2MB shared L2 cache) with a TDP of 15W gives a remarkable increase in performance/watt.

To enhance overall memory and I/O performance the AM 100/20x utilizes the Intel 3100 chipset. The Intel 3100 chipset, a single chip embedded server chipset, interfaces up to 16 GBytes DDR2-400 ECC memory with a peak memory bandwidth of 3.2 Gigabytes/s.

“For military, defence and telco applications, the combination of the Dual-Core Intel Xeon Processor LV and the Intel 3100 chipset is maximizing energy efficient performance for thermally dense computing environments like the AMC market segment,” says Rose Schooler, Director of Marketing, Intel Infrastructure Processor Division. “For thirty years Intel has been continuously supporting the embedded market segment, and Concurrent Technologies is utilizing the benefits of embedded Intel architecture to bring innovation and long term stability to this leading edge standards-based form factor.”

The AM 100/20x is designed in compliance to AMC.0 (including full hot swap and IPMI capabilities), AMC.1 Type 8 (PCI Express x8), AMC.2 Type E2 (2x Gigabit Ethernet) and AMC.3 Type S2 (4x Serial ATA150 ports). The module also features a graphics interface, four USB 2.0 ports and two RS232 ports.

For ease of integration, many of today’s leading operating systems are supported including Linux(R), Windows(R) 2000, Windows(R) Server 2003, Windows(R) XP, Windows(R) XP Embedded and QNX(R).

The AdvancedMC (AMC) specification is ratified by PICMG(R) to be compatible with the current AdvancedTCA (ATCA) and the MicroTCA system architectures. The AMC concept provides a system integrator with a modular approach that is scalable, cost effective, fabric based, and hot swappable. The modules are designed according to a series of AMC.x specifications – where AMC.0 defines the form-factor, connector, power and thermal characteristics, management, clocking and base fabric, AMC.1 maps PCI Express onto the extended fabric interface, AMC.2 defines Ethernet ports, AMC.3 defines mass storage ports and AMC.4 defines Serial RapidIO.

About Concurrent Technologies
Concurrent Technologies is an international ISO 9001:2000 company specializing in the design and manufacture of commercial-off-the-shelf and custom designed industrial computer boards for real-time embedded applications. The company, which was founded in 1985, has offices in the USA, China and UK as well as a worldwide distributor network. In addition to its original Multibus II product line the company has a wide range of high performance Intel(R) processor based VME, CompactPCI(R) and AdvancedMC(R) products, which are complemented by an extensive offering of PMC (PCI Mezzanine Card) products. Concurrent Technologies is an Affiliate Member of the Intel(R) Communications Alliance (ICA), a community of communications and embedded developers and solution providers.

Intel, Intel Core Duo, Intel Dual-Core, and Intel Xeon are trademarks or registered trademarks of Intel Corporation or its subsidiaries in the United States and other countries.