e2v Launches PC109 Host Processor Bridge for Extended-Reliability

e2v extends its high-reliability processor offering by launching the PC109(TM) Host Processor Bridge, the extended-reliability version of the Tundra Tsi109(TM) Host Bridge from Tundra Semiconductor Corporation. Following closely after the signing of an agreement between e2v and Tundra to provide System Interconnect products for extended-reliability markets, the PC109 Host Bridge provides system interconnect between PowerPC(R) processors, PCI peripherals and local memory. The PC109 is capable of supporting two processors connected through the MPX bus and is capable of operating at a bus speed up to 167 MHz (or up to 200 MHz when supporting a single processor).

“The PC109 Host Bridge companion chip ideally complements the PC7447A and PC7448 high-reliability microprocessors and will deliver our customer’s higher optimized design for high performance applications while reducing the overall system costs”, said Eric Marcelot e2v’s Product Marketing Manager for e2v’s High-Reliability Microprocessors. “We are proud to deliver this product only two months after announcing our agreement with Tundra, and we are looking forward to introducing more system interconnect products from Tundra that satisfy the most demanding system performance requirements of some high-reliability embedded applications such as radars, aircraft displays, electronic countermeasures, where performance, power efficiency and reliability are critical to the mission’s success.”

“Customers with high reliability requirements, particularly in extreme environments, now have an opportunity to take advantage of all of the performance benefits of Tundra’s Tsi109, in the new PC109 which e2v has launched today. Partnering with e2v is a win-win for Tundra, for e2v and for the unique industries that these products serve, said Rick O’Connor, Chief Technology Officer at Tundra.

The PC109 features a DDR2 memory controller supporting DDR2-400 devices. The 133MHz PCI-X interface and the two Gigabit Ethernet ports offer a very high data bandwidth. With its low level of active power and integrated features such as clock generation, DMA, Interrupt Controller, I²C, UART, the PC109 provides system designers with greater overall system performance, and reduced system design complexity, while delivering best system performance-per-watt.

The PC109 host bridge for PowerPC is available for sampling in a 1023-ball Flip-Chip Plastic BGA package. Production ramp-up is scheduled over the fourth quarter of 2006, and product qualification is planned to be completed in first quarter of 2007.

e2v technologies plc
e2v technologies is a leading designer, developer and manufacturer of specialised components and subsystems, falling within two product groups:

  • Electronic tubes
  • Sensors and Semiconductors

These products enable some of the world’s leading OEMs to deliver innovative systems for medical and science, aerospace and defence, and industrial and commercial applications.

For the year ended 31 March 2006, e2v achieved sales of £112m and is listed on the London Stock Exchange (e2v.l). In July 2006 e2v technologies plc acquired a leading designer, manufacturer and distributor of specialised electronic components and sub-systems, based in Grenoble, France. The acquisition represents an opportunity to strengthen the Group’s position as a major global provider of specialised electronic components and sub-systems.

e2v’s products are supplied into three core market areas:

  • Medical & Science: Sensor technology includes imaging sensors for intra-oral and panoramic dental X-ray, mammography, life science applications and X-ray microscopy. Electronic tubes are the enabling technology behind radiotherapy cancer treatments, microwave medical therapy and high-energy physics.
  • Aerospace & Defence: Sensor technology includes military surveillance, targeting and guidance, space-based imaging and astronomy and radar & electronic warfare and broadband data converters and microprocessors for aerospace applications. Electronic tubes provide the enabling technology behind radars, electronic countermeasures (ECM), electronic warfare and satellite communications.
  • Commercial & Industrial: Sensor technology includes marine radars, industrial safety sensors, automotive radars and alarms, thermal imaging cameras used by fire fighters, CCD and CMOS high resolution area scan cameras for industrial inspection. Electronic tubes provide enabling technology behind TV broadcast, satellite communications, marine radar and food & industrial processing.

The overall purpose of the business is to grow sustainable shareholder value whilst appropriately meeting the expectations of customers, people, partners, suppliers and the wider community. e2v’s vision is to create value through bright ideas in technology and materials science. The Company’s mission is to place customers at the heart of the business, providing enabling products of premium quality that extend technical barriers and enhance the competitive position of our partners.
e2v has approximately 1,800 employees worldwide with three UK based manufacturing sites in Chelmsford, Lincoln and High Wycombe, and one in Grenoble, France. In addition e2v has sales offices in the UK, USA, Germany and France, as well as a network of distributors and representatives covering other key territories.

About Tundra
Tundra Semiconductor Corporation is the global leader in System Interconnect providing world-class support and leading edge semiconductor solutions to the world’s foremost communications, networking, storage system, and information technology vendors. Consistently delivering on system level performance promises that reduce time to market, Tundra System Interconnect ensures market advantage in wireless infrastructure, storage networking, network access, military, industrial automation, and information technology applications.

TUNDRA and the Tundra logo are registered marks of Tundra Semiconductor Corporation in Canada, the European Union and the People’s Republic of China (registration is pending in the United States). Design.Connect.Go is a trademark of Tundra Semiconductor Corporation. Tsi109 is a trademark of Tundra Semiconductor Corporation. The PowerPC name, Power Architecture name, and the PowerPC logotype are trademarks of International Business Machines Corporation, used under license therefrom.