Renesas Technology Corp. today announced that it has begun shipping samples of the SH-Mobile G2, a single-chip LSI for dual-mode HSDPA/W-CDMA and GSM/GPRS/EDGE mobile phones. The LSI was jointly developed with NTT DoCoMo, Inc., Fujitsu Limited, Mitsubishi Electric Corporation, and Sharp Corporation, and evaluation samples have been shipped to these handset manufacturers since the end of September 2006.
The second generation product in the SH-Mobile G Series, the SH-Mobile G2 aims to accelerate the global adoption of W-CDMA services such as FOMA(R) and to reduce the cost of these handsets. To provide a complete platform solution to these markets, the SH-Mobile G Series combines a dual-mode baseband processor and the SH-Mobile application processor in a single chip. Since the first generation SH-Mobile G1, which was jointly developed with NTT DoCoMo for W-CDMA and GSM/GPRS handsets, the SH-Mobile G2 was developed together with three additional handset manufacturers to deliver enhanced technology and additional functionality.
For example, the SH-Mobile G2 supports HSDPA and EDGE handsets and achieves a faster transfer rate of 3.6 Mbps. The SH-Mobile G2 is available with a complete mobile phone reference platform that combines software, such as an operating system, middleware, and drivers, as well as common hardware such as a power supply IC and a RFIC. The highly integrated mobile phone platform will simplify the system implementation with handsets and eliminate the need for handset manufacturers to develop common functions on their own. At the same time, it will reduce development time and cost, allowing manufacturers to dedicate resources for developing handsets with superior features.
“We are delighted to deliver the SH-Mobile G2 for FOMA and other W-CDMA mobile phones, as the successor to the previous-generation SH-Mobile G1 both with integrated baseband and application processors,” said Ikuya Kawasaki, deputy general manager of system solution business unit 2 at Renesas Technology Corp. “We plan to aggressively promote the SH-Mobile G2 globally as a competitive and high-performance mobile phone platform. At the same time, Renesas plans to contribute to the expansion of the W-CDMA mobile phone market.”
Renesas plans to begin volume production of the SH-Mobile G2 in the third quarter of 2007 and will offer the W-CDMA mobile phone platform worldwide to W-CDMA and FOMA handsets.
About Renesas Technology Corp.
Renesas Technology Corp. is one of the world’s leading semiconductor system solutions providers for mobile, automotive and PC/AV (Audio Visual) markets and the world’s No.1 supplier of microcontrollers. It is also a leading provider of LCD Driver ICs, Smart Card microcontrollers, RF-ICs, High Power Amplifiers, Mixed Signal ICs, System-on-Chip (SoC), System-in-Package (SiP) and more. Established in 2003 as a joint venture between Hitachi, Ltd. (TOKYO:6501)(NYSE:HIT) and Mitsubishi Electric Corporation (TOKYO:6503), Renesas Technology achieved consolidated revenue of 906 billion JPY in FY2005 (end of March 2006). Renesas Technology is based in Tokyo, Japan and has a global network of manufacturing, design and sales operations in around 20 countries with about 26,200 employees worldwide.
FOMA(R) is a trademark or registered trademark of NTT DoCoMo, Inc. in Japan and other countries.