Aehr Test Systems (Nasdaq: AEHR), a leading manufacturer of parallel test and burn-in systems, today announced that it has shipped its first FOX-1 full wafer parallel tester to a leading IC manufacturer. The shipment also included a single touchdown full-wafer contactor.
“This is a major accomplishment for Aehr Test, as many innovations were required to complete this exciting new product,” said Rhea Posedel, chairman and chief executive officer of Aehr Test Systems. “I’m proud of our team for making it happen. Since we believe that our FOX-1 system can significantly increase throughput and reduce test costs, we expect to receive follow-on orders for this leading-edge test system.”
The FOX-1 full wafer parallel test system, a member of the FOX family of full wafer contact systems, is designed to test an entire wafer of devices with a single touchdown or be utilized for short-duration burn-in and test. This innovative solution combines full wafer contact, massively parallel test and Design For Test (DFT) technologies. Other members of Aehr Test’s FOX family of products are focused on long-duration full wafer burn-in and test of products such as automotive ICs, DRAMs and VCSELs (laser diodes).
About Aehr Test Systems
Headquartered in Fremont, California, Aehr Test Systems is a leading worldwide provider of systems for burning-in and testing DRAM and logic integrated circuits and has an installed base of more than 2,500 systems worldwide. Aehr Test has developed and introduced several innovative products, including the FOX, MTX and MAX systems and the DiePak(R) carrier. The FOX system is a full wafer contact test and burn-in system. The MTX system is a massively parallel test system designed to reduce the cost of memory testing by performing both test and burn-in on thousands of devices simultaneously. The MAX system can effectively burn-in and functionally test complex devices, such as digital signal processors, microprocessors, microcontrollers and systems-on-a-chip. The DiePak carrier is a reusable, temporary package that enables IC manufacturers to perform cost-effective final test and burn-in of bare die.