SEMI reported that worldwide semiconductor manufacturing equipment billings reached $9.59 billion in the second quarter of 2006. The billings figure is 0.2 percent higher than the first quarter of 2006 and about twenty-seven percent above the same quarter a year ago. The data is gathered in cooperation with the Semiconductor Equipment Association of Japan (SEAJ) from more than 150 global equipment companies that provide data on a monthly basis.
SEMI also reported worldwide semiconductor equipment bookings of US$11.53 billion in the second quarter of 2006. The figure is 60 percent above the same quarter a year ago, and about 23 percent above the bookings figure for the first quarter of 2006.
“In the second quarter of 2006, worldwide bookings for semiconductor manufacturing equipment posted strong sequential gains, while billings reached their highest levels since the first quarter of 2001,” said Stanley T. Myers, president and CEO of SEMI.
The Equipment Market Data Subscription (EMDS) from SEMI provides comprehensive market data for the global semiconductor equipment market. A subscription includes three reports: the monthly SEMI Book-to-Bill Report, which offers an early perspective of the trends in the equipment market; the monthly Worldwide Semiconductor Equipment Market Statistics (SEMS), a detailed report of semiconductor equipment bookings and billings for seven regions and 22 market segments; and the SEMI Semiconductor Equipment Consensus Forecast, which provides an outlook for the semiconductor equipment market. For more information or to subscribe, please contact SEMI customer service at 1.877.746.7788 (toll free in the U.S.) or 1.408.943.6901 (International Callers).
SEMI is a global industry association serving companies that provide equipment, materials and services used to manufacture semiconductors, displays, nano-scaled structures, micro-electromechanical systems (MEMS) and related technologies. SEMI maintains offices in Austin, Beijing, Brussels, Hsinchu, Moscow, San Jose (Calif.), Seoul, Shanghai, Singapore, Tokyo and Washington, D.C.