Tundra Semiconductor Corporation (TSX:TUN), the leader in System Interconnect, announced that GE Fanuc Embedded Systems, formerly SBS Technologies, has incorporated the Tundra Tsi109 Host Bridge, the industry’s highest performing host bridge for PowerPC, into its new Telum TSPE01 processor Advanced Mezzanine Card (AdvancedMC(R)), the first PrAMC on the market.
Compliant with the AMC.0 and AMC.2 specifications, the Freescale Semiconductor MPC7447A processor-based TSPE01 is designed for use in a broad range of high-performance telecom applications such as wireless base stations, Voice over IP, test and measurement systems, media servers, base station controllers, and server blade applications.
GE Fanuc Embedded Systems selected Tundra to deliver the best mix of performance and power management, backed by Tundra’s world-class design support. The Tsi109 Host Bridge supports the emerging DDR2 memory standard and has a 200 MHz 60x processor bus, while consuming just 2.5 Watts of power. In addition, Tundra, along with Freescale, was able to provide GE Fanuc Embedded Systems with a complete reference design, shortening its design cycle and time-to-market.
“With the Tsi109′s DDR2 memory support and low power consumption, Tundra provided us with the high-level system performance and capacity that our customers are demanding,” said Rubin Dhillon, Communications Product Management for GE Fanuc Embedded Systems. “Also, by providing us with an evaluation board including the Freescale processor, we were able to ensure that we met our go-to-market schedule, avoiding the normal delays which can arise when you’re working with new form factors such as AMC that have limited ecosystem support.”
About the Tsi109 Host Bridge
The Tsi109′s innovative feature set and high reliability, backed by outstanding design support, provides designers with, greater overall system performance, reduced system design complexity and superior power efficiency. The Tsi109 host bridge sets industry benchmarks for performance and power management through an innovative feature set supported by world-class design support. This host bridge supports a dual processor bus at 167 MHz, which enables higher system compute performance. The Tsi109′s superior memory pipeline offers industry-leading memory bandwidth and an optimized PCI-X interface provides greater I/O-to-memory throughput. In addition to 2.5 Watt typical power dissipation, the Tsi109 supports DDR2 memory, which makes this host bridge the ideal choice for high-density, power-sensitive applications and lowers system cost. The combination of the Tsi109′s features and reliability with Tundra’s world-class support provides designers with the benefits of greater overall system performance, reduced system design complexity, better integration and superior power efficiency.
Availability and Design Support Tools
The Tsi109 is available in both standard and RoHS compliant packages for commercial and industrial temperatures. Volume pricing for the Tsi109 is under $75USD. For documentation, including ordering information, user manuals, and software drivers, to assist in accelerated development with the Tsi109, go go online.
About the TSPE01
The Telum TSPE01 is a single width, full height AdvancedMC processor board with up to 1 Gbyte of soldered DDR2-400 SDRAM system memory and dual Gigabit Ethernet channels to the B+ Carrier connector and a single 10/100Base Ethernet RJ-45 port on the front panel. It joins the Telum ASLP10 Intel(R) Pentium(R) M processor AdvancedMC in GE Fanuc Embedded Systems’ extensive Telum line of AdvancedMC products.
Available now, the pricing for the Telum TSPE01 in OEM quantities starts at US$1,425.
About Tundra Host Bridges for PowerPC(R)
Host bridges interconnect PowerPC processors with subsystems and are critical components in embedded designs. With over a decade of investment and experience supporting PowerPC-based designs, Tundra Host Bridges for PowerPC have been widely adopted by market leaders. Tundra Host Bridges include, the Tsi107TM, Tsi108TM, Tsi109, and Tsi110TM, and are regarded as the best companion chips for the industry’s leading PowerPC processor vendors – Freescale Semiconductor and IBM. The Tsi109 supports dual processors and supports several I/O peripherals – PCI, PCI-X, DDR2 Memory, and Gigabit Ethernet. To maintain software investment and accelerated development cycles, the Tsi109 is software and pin compatible with the Tsi108. The Tsi109 optimizes overall system performance, power and cost, while offering the industry’s best signal integrity.
About Tundra Semiconductor
Tundra Semiconductor Corporation (TSX:TUN) is the global leader in System Interconnect providing world-class customer and technical support, leading-edge semiconductor solutions and design services to the world’s foremost communications, networking, storage system, and information technology vendors. Consistently delivering on system level performance promises that reduce time to market, Tundra System Interconnect products ensure market advantage in wireless infrastructure, storage networking, network access, military, industrial automation, and information technology applications. Silicon Logic Engineering, Inc. (SLE), Tundra’s semiconductor design services division, offers industry-leading ASIC design services, semiconductor intellectual property and product development consulting.
About GE Fanuc Embedded Systems
GE Fanuc Embedded Systems is a leading global provider of embedded computing solutions for a wide range of industries and applications. Featuring a comprehensive offering that includes Intel(R) and PowerPC(R) -based Single Board Computers, networking products, avionics interfaces, rugged flat panel monitors and complete computer systems, GE Fanuc Embedded Systems can support the full range of embedded computing needs. GE Fanuc Embedded Systems is part of GE Fanuc Automation, a joint venture between GE and FANUC LTD of Japan. For more information, contact: GE Fanuc Embedded Systems, 7401 Snaproll NE, Albuquerque, NM 87109, Phone: (800) 875-0600, Fax: (505) 798-1400, e-mail.
TUNDRA is a registered trademark of Tundra Semiconductor Corporation (Canada, U.S. and U.K.). TUNDRA and the Tundra logo are registered marks of Tundra Semiconductor Corporation (Canada – registration in the United States, European Union, and People’s Republic of China). Tsi107, Tsi108, Tsi109, Tsi110 and Design.Connect.Go are trademarks of Tundra Semiconductor Corporation. The PowerPC name, Power Architecture name, and the PowerPC logotype are trademarks of International Business Machines Corporation, used under license therefrom.