Top Korean Designers Attend Sequence Low-Power Seminar

Sequence Design set an attendance record at a recent low-power design seminar in Seoul attended by scores of top designers representing 18 major Korean semiconductor companies. Co-sponsored by HP and Sequence’s Korean distributor, DavanTech, the daylong seminar addressed major problems affecting chip design for consumer, mobile, and highly integrated devices. Sequence presentations and invited speakers focused on four areas: predicting power consumption early in the design cycle, reduction of switching power consumption, reduction of leakage power, and efficient power-grid design.

Korea’s fast-growing chip design market had 2005 sales of $19 billion, and is gaining market share in power-sensitive applications fueled by global demand for cell phones, Digital Multimedia Broadcasting (DMB), MP3, and digital TV applications.

Professor Hyunchul Shin of the college of engineering sciences, Hanyang University, was the keynote speaker, addressing the challenge of designing large, sub-90nm SoCs for low power. Presenting a highly detailed and technical talk offering insights into numerous strategies for low-power design, Professor Shin concluded that power affects multiple aspects of design, including package cost and reliability. To effectively deal with these issues, designers must be “power-aware” at every step, from architectural exploration to manufacturing, and employ integrated tools and methods to achieve concurrent results with timing, signal integrity, and electromigration.

Sequence CTO, Jerry Frenkil, presented a series of case studies, examining how successful teams have made power integrity a key part of their design flow. “Here in Korea they really get it,” Frenkil said. “This is a hotbed of portable design for low-power applications, and Sequence is uniquely positioned to provide EDA solutions in the areas of RTL power analysis and optimization, active and leakage power management, and timing and SI optimization as these designers face sub-90 nm SoC design challenges.”