The complex assembly of many solid objects (such as PCBs, electronics packages and devices, cabling, fans, and heatsinks) inside electronics equipment means air flow is confined within narrow regions between these solid objects. Electronics products pose a unique set of challenges for thermal simulation because of this complexity.
The display interface provides a MIPI DSI bridge from the processor to an embedded DisplayPort LCD at 30 percent higher bandwidth than competing devices. The SN65DSI86 will be demonstrated at the Consumer Electronics Show in 2014.
Cadence Design Systems introduced its Encounter RTL Compiler version 13.1 that can deliver up to 15 percent improvements in power, performance, and area with a new suite of physically aware RTL synthesis capabilities. The production-ready physical synthesis engine enables designers to use physical-aware techniques at earlier synthesis phases for better results in silicon. The new RTL Compiler inserts physical awareness into stages of synthesis that have previously been logic only.
At 28 nm and below, it’s difficult for designers to get optimal timing and closer as interconnect characteristics change. Cadence’s RTL compiler helps these complex and advanced chip designs deal with their timing and congestion challenges, and deal with them sooner. Addressing these problems earlier in the design process helps achieve faster timing closure and improve power, performance, and area.
Encounter RTL Compiler capabilities:
Physically aware structuring
Multi-bit cell inferencing
Design for test
More than 10 percent performance improvement from physically aware structuring and mapping
More than 15 percent area improvement on complex SoCs from pin and register placement considerations when choosing which microarchitecture to synthesize to and how to balance them
10 percent or more power decrease from physically aware multi-bit cell inferencing by merging single registers into clock-sharing multi-bit registers
Fujitsu Semiconductor collaborated with Cadence and used the new RTL compiler on several production design developments. As a result, they were able to improve timing and area by more than 10 percent, which allowed them to be able to make smaller chips for their customers.
Real Intent’s Ascent and Meridian early verification and advanced sign-off solutions will be presented by Director of Strategic Accounts Dr. Roger Hughes at the November 18, 2013 SemIsrael Expo 2013. Dr. Hughes will focus on formal verification’s role in Clock-Domain Crossing (CDC) in the presentation “Formal is Normal: Automatically Refine Your CDC Checking.”
Microchip Technology introduced the MGC3130 Hillstar Development Kit for 3D gesturing systems. The MGC3130 Hillstar Development Kit enables engineers to integrate an advanced 3D hand-position and gesturing user interface to virtually any electronic product. The Hillstar Development Kit (part #DM160218) is available for now for $179. The MGC3130 Configurable 3D Gesture Controller is shipping in production volumes.
Microchip Technology announced a cloud development platform. The service is available on the Amazon Web Services (AWS) Marketplace and enables embedded engineers to quickly learn cloud based communication. Microchip’s Cloud Development Platform is available now. As part of this platform, their Wi-Fi Client Module Development Kit is available for purchase for $99.
Texas Instruments announced the LMP92064 IC. It is the industry’s first digital current sensor and voltage monitor with simultaneous sampling and SPI interface. The TI LMP92064 is available now in a 16-pin, 5-mm x 4-mm WSON package for a suggested retail price of $1.99 in 1,000-unit quantities. The LMP92064 is ideal for applications where precise power monitoring is crucial, such as communications infrastructure applications, including telecom, servers and central office equipment.
Direct Insight introduced the TRITON-TXFB production-quality ARM board. The TRITON-TXFB is configurable by changing a tiny (68mm x 26mm) processor module — from ARM9 to quad core ARM Cortex-A9. Unlike the many available community boards, the TRITON-TXFB is fully production-ready, with industrial temperature range support and protected I/O. It is intended for low and medium volume use in end-user products. The baseboards, modules, and Linux, Windows CE and Android software packages are available now.
Texas Instruments announced their PGA281 programmable gain amplifier. The TI PGA281 is a fully differential, zero-drift, 36-V PGA. The PGA281 is available now in a 5mm by 6.4mm, 16-pin TSSOP package, specified over a temperature range of -40 C to +105 C. The device has a suggested retail price of $2.55 in 1,000-unit quantities.
Accellera Systems Initiative has developed new vendor extensions for IEEE 1685-2009: IP-XACT, Standard Structure for Packaging, Integrating and Reusing IP within Tool Flows. IP-XACT enabled IP is leveraged by a wide range of companies. The vendor extensions reinforce Accellera’s commitment to shape IP standards that promote reuse and speed designer productivity substantially.